Electronic component unit and electronic apparatus

ABSTRACT

Airflow is introduced into an enclosure through an air inlet in an electronic component unit. The airflow runs toward a first electronic component. The airflow absorbs heat from the first electronic component. The first electronic component is thus sufficiently cooled. A second electronic component is mounted on a printed wiring board at a position remoter from the air inlet than the position of the first electronic component. An air intake opening is formed in the enclosure. The air intake opening is defined at a section of the enclosure opposed to the printed wiring board at least between the first and second electronic components. Airflow is introduced toward the second electronic component through the air intake opening. The second electronic opening is thus sufficiently cooled. In this manner, the first and second electronic components are cooled equally to the utmost.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional of prior application Ser. No.11/387,761 filed on Mar. 24, 2006, the entire contents of which areincorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an electronic component unit such as asystem board unit incorporated in a server computer or the like.

2. Description of the Prior Art

A system board unit is incorporated in a server computer, for example.The system board unit includes a printed circuit board or system board.The system board includes central processing unit (CPU) chips mounted ona printed wiring board. A heat sink is received on the individual CPUchip. Airflow runs within the system board unit to cool the CPU chips. Afan is placed in the server computer 11 so as to generate the airflow.The CPU chips are arranged along the direction of the airflow, forexample.

The airflow in the server computer absorbs heat from the heat sinks onthe CPU chips at upstream positions. The airflow is thus heated. Theheated airflow cannot sufficiently absorb heat from the CPU chips atdownstream positions. This causes a rise in the temperature of the CPUchips at the downstream positions. The CPU chips at the downstreampositions suffer from a reduced processing speed. Since the processingspeeds of all the CPU chips are normally set equal, for example, theprocessing speed of the CPU chips at the upstream positions is leveleddown to the processing speed of the CPU chips at the downstreampositions.

SUMMARY OF THE INVENTION

It is accordingly an object of the present invention to provide anelectronic component unit and an electronic apparatus allowingelectronic components to get cooled quite equally.

According to a first aspect of the present invention, there is providedan electronic component unit comprising: an enclosure; an air inletdefined in the enclosure; a printed wiring board placed within theenclosure; a first electronic component mounted on the printed wiringboard; a second electronic component mounted on the printed wiring boardat a position remoter from the air inlet than the position of the firstelectronic component; and an opening defined in the enclosure at asection opposed to the printed wiring board between the first and secondelectronic components, the opening designed to such air into theenclosure.

The electronic component unit allows airflow to run into the enclosurethrough the air inlet. The airflow runs toward the first electroniccomponent. The airflow absorbs heat from the first electronic component.The first electronic component is thus sufficiently cooled down. Thesecond electronic component is mounted on the printed wiring board at aposition remoter from the air inlet than the position of the firstelectronic component. The opening is formed in the enclosure for suckingair into the enclosure. The opening is defined in the enclosure at asection opposed to the printed wiring board between the first and secondelectronic components. Airflow is thus allowed to run toward the secondelectronic component through the opening. The second electroniccomponent is sufficiently cooled down. Even though the second electroniccomponent is placed at the position remoter from the air inlet than theposition of the first electronic component, the first and secondelectronic components can be cooled quite equally.

The first and second electronic components may be placed in a firstspace extending from the air inlet in the electronic component unit. Inthis case, a guiding member may be placed in a second space extendingfrom the air inlet in parallel with the first space. The guiding membermay define an air guiding surface designed to guide airflow to thesecond electronic component.

The guiding member is placed within the second space parallel to thefirst space in the electronic component unit. The guiding member definesthe air guiding surface designed to guide airflow to the secondelectronic component. Airflow is introduced into the second spacethrough the air inlet. The airflow collides against the air guidingsurface. The airflow is guided to the second electronic component alongthe air guiding surface. Even though the first and second electroniccomponents are placed in the first space, the second component cansufficiently be cooled down. Airflow is also introduced into the firstspace through the air inlet. The airflow serves to sufficiently cool thefirst electronic component. The first and second electronic componentscan thus be cooled quite equally.

According to a second aspect of the present invention, there is providedan electronic component unit comprising: an enclosure; an air inletdefined in the enclosure; a printed wiring board placed within theenclosure; a first electronic component mounted on the printed wiringboard, the first electronic component placed in a first space extendingfrom the air inlet; a second electronic component mounted on the printedwiring board at a position remoter from the air inlet than the positionof the first electronic component, the second electronic componentplaced in the first space; and a guiding member placed in a second spaceextending from the air inlet in parallel with the first space, theguiding member defining an air guiding surface designed to guide airflowto the second electronic component.

The electronic component unit allows airflow to run into the first spacethrough the air inlet. The airflow runs toward the first electroniccomponent. The airflow absorbs heat from the first electronic component.The first electronic component is thus sufficiently cooled down. Thesecond electronic component is mounted on the printed wiring board at aposition remoter from the air inlet than the position of the firstelectronic component. The guiding member is placed in the second spaceextending in parallel with the first space. The guiding member definesthe air guiding surface designed to guide airflow to the secondelectronic component. Airflow is allowed to run into the second spacethrough the air inlet. The airflow collides against the air guidingsurface. The air guiding surface serves to direct the airflow to thesecond electronic component. The second electronic component can thussufficiently be cooled down. Even though the first and second electroniccomponents are placed in the first space, the first and secondelectronic components can be cooled quite equally.

The electronic component unit may further comprise a third electroniccomponent mounted on the printed wiring board, the third electroniccomponent placed in the second space. The second space may comprise alower space defined on the surface of the printed wiring board, thelower space containing the third electronic component; and an upperspace layered on the lower space on the printed wiring board, the upperspace containing the guiding member.

Airflow introduced into the upper space is allowed to run toward theguiding member in the electronic component unit. The air guiding surfaceserves to direct the airflow toward the second electronic component. Thesecond electronic component is thus sufficiently cooled down. Theairflow introduced into the lower space runs along the third electroniccomponent. The airflow absorbs heat from the third electronic component.Even though the guiding member is placed in the second space, the thirdelectronic component can sufficiently get cooled. The inner space of theenclosure can efficiently be utilized. The air guiding surface may getremoter from the air inlet at a position closer to the second electroniccomponent.

According to a third aspect of the present invention, there is providedan electronic component unit comprising: an enclosure; a first openingformed in the enclosure at a first end; a second opening formed in theenclosure at the first end at a position adjacent to the first opening;a third opening formed in the enclosure at a second end opposite to thefirst end; a first component placed in a first space defined between thefirst and third openings; a second component placed in a second spacedefined between the second and third openings; and a guiding memberplaced in a third space defined in the second space at a positionadjacent to the first space.

The electronic component unit allows airflow to run from the first andsecond openings to the third opening, respectively. Airflow is allowedto run from the first opening to the first component in the first space.The airflow absorbs heat from the first component. The first componentis thus cooled down. The third space is defined in the second space atthe position adjacent to the first space. The guiding member is placedin the third space. The guiding member serves to guide airflow, forexample. Airflow runs from the second opening to the second component inthe second space regardless of the guiding member. The airflow serves toabsorb heat from the second component. The second component is thuscooled down. The first and second electronic components can sufficientlyget cooled in the enclosure in this manner.

The guiding member of the electronic component unit may have an endsurface extending, from a position remote from the first space in thesecond space and close to the first end, toward a position close to thefirst space in the second space and close to the second end.

Airflow is introduced into the second space through the second opening.The airflow collides against the end surface. The end surface extends inthe second space from the position remote from the first space to theposition close to the first space. Simultaneously, the end surfaceextends from the position close to the first end to the position closeto the second end. The airflow is thus directed to the first space fromthe second space. The airflow can be utilized to cool the firstcomponent. The airflow within the enclosure can efficiently be utilized.

The first component of the electronic component unit may comprise: afirst component unit; and a second component unit placed at a positioncloser to the third opening than the position of the first componentunit. In this case, the guiding member may have an end surfaceextending., from a position remote from the first space in the secondspace and close to the first end, toward a position close to the firstspace in the second space and close to the second end.

The first component comprises the first and second component units. Thesecond component unit is placed at the position closer to the thirdopening than the position of the first component unit. The airflow runsthrough the first opening as described above. The airflow absorbs heatfrom the first component unit. The first component unit is thus cooleddown. Simultaneously, airflow is allowed to run into the second spacethrough the second opening. The airflow collides against the endsurface. The end surface extends, from a position remote from the firstspace in the second space and close to the first end, toward a positionclose to the first space in the second space and close to the secondend. The airflow can thus be directed to the second component unit inthe first space from the second space. The airflow can be utilized tocool the second component unit. Even though the second component unit isplaced at the position closer to the third opening than the position ofthe first component unit, the first and second component units can getcooled equally.

The electronic component unit may further comprise a fourth openingformed in the enclosure, the fourth opening being opened into the firstspace. In this case, the first component may comprise: a first componentunit; and a second component unit placed at a position closer to thethird opening than the first component unit is. The fourth opening maybe formed in the enclosure at least between a position corresponding tothe position of the first component unit and a position corresponding tothe position of the second component unit. The electronic component unitallows airflow to run from the fourth opening to the second componentunit. The airflow absorbs heat from the second component unit. Thesecond component unit is thus cooled down. The first and secondcomponent units can get cooled quite equally in this manner.

The electronic component unit may be incorporated in an electronicapparatus. The electronic apparatus may comprise: an outer enclosure;and an electronic component unit attached to the outer enclosure. Theelectronic component unit may comprise: a unit enclosure; a firstopening formed in the unit enclosure at a first end of the unitenclosure; a second opening formed in the unit enclosure at the firstend at a position adjacent to the first opening; a third opening formedin the unit enclosure at a second end opposite to the first end; a firstcomponent placed in a first space defined between the first and thirdopenings; a second component placed in a second space defined betweenthe second and third openings; and a guiding member placed in a thirdspace defined in the second space at a position adjacent to the firstspace. The electronic apparatus may further comprise a fan placed withinthe outer enclosure, the fan generating airflow running from the firstand second openings toward the third opening.

According to a fourth aspect of the present invention, there is providedan electronic component unit comprising: an enclosure; a first componentplaced within the enclosure; a second component placed at a positioncloser to an end of the enclosure than the position of the firstcomponent; and an opening formed in the enclosure between a positioncorresponding to the position of the first component and a positioncorresponding to the position of the second component.

The second component is placed within the enclosure at the positioncloser to the end of the enclosure than the first component is. Airflowruns from the opening to the second component, for example. The airflowabsorbs heat from the second component. The electronic component unitallows the second component to efficiently be cooled even if the firstand second components are arranged.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other objects, features and advantages of the presentinvention will become apparent from the following description of thepreferred embodiment in conjunction with the accompanying drawings,wherein:

FIG. 1 is a perspective view schematically illustrating a servercomputer as a specific example of an electronic apparatus according toan embodiment of the present invention;

FIG. 2 is a perspective view schematically illustrating a system boardunit as a specific example of an electronic component unit according tothe present invention;

FIG. 3 is a perspective view schematically illustrating the innerstructure of the system board unit;

FIG. 4 is a perspective view illustrating the position of air inletopenings defined in the top plate of an enclosure;

FIG. 5; is a perspective view schematically illustrating airflow runningthrough first and second spaces;

FIG. 6 is a perspective view schematically illustrating airflow runningthrough the second space; and

FIG. 7 is a perspective view schematically illustrating airflowintroduced into the enclosure through the air intake openings.

DESCRIPTION OF THE PREFERRED EMBODIMENT

FIG. 1 schematically illustrates a server computer 11 as a specificexample of an electronic apparatus according to an embodiment of thepresent invention. The server computer 11 includes an enclosure 12 as anexternal enclosure. Input/output units 13 are mounted on the lower rackof the enclosure 12. The individual input/output unit 13 includes aprinted wiring board. The printed wiring board stands upright in thevertical direction perpendicular to the floor. A PCI board is forexample incorporated in the individual input/output unit 13. A LAN cableor the like is coupled to the PCI board.

Electronic component units, namely system board units 14, are mounted onthe middle rack of the enclosure 12. The system board units 14 areinserted into the enclosure 12 from the front of the enclosure 12. Aback panel is placed in the enclosure 12. The individual system boardunit 14 includes a connector at an end. The connector is coupled to theback panel. The system board unit 14 includes a printed circuit board,namely a system board. The system board stands upright in the verticaldirection perpendicular to the floor.

Fan units 15 are mounted on the upper rack of the enclosure 12. Theindividual fan unit 15 includes axial flow fans, for example. The fanunit 15 generates airflow in the enclosure 12 based on the rotation ofthe rotor in the individual axial flow fan. The rotation axes of therotors extend in the vertical direction perpendicular to the floor. Thegenerated airflow thus runs in the vertical direction from the bottom ofthe enclosure 12 toward the top of the enclosure 12. The airflow absorbsheat from the input/output units 13 and the system board units 14.

Power source units 16 are mounted on the uppermost rack of the enclosure12. The server computer 11 is connected to an outlet through a cable.The power source units 16 serve to transform the alternating currentsupplied from the outlet into the direct current. The direct current issupplied to the fan units 15 and the aforementioned back panel. The backpanel passes the direct current to the input/output units 13 and thesystem board units 14.

FIG. 2 is a perspective view schematically illustrating the system boardunit 14. As shown in FIG. 2, the system board unit 14 includes a unitenclosure 21 defining an inner space in the form of a flatparallelepiped, for example. The unit enclosure 21 may be made of ametal plate such as a stainless steel or the like. A grip 22 is fixed tothe front of the unit enclosure 21. One can hold the grip 22 to pull thesystem board unit 14 out of the server computer 11. When the systemboard unit 14 is mounted on the server computer 11, the unit enclosure21 takes an upright attitude in the direction of gravity, namely in thevertical direction.

An opening, namely an air inlet 23, is defined at one side of the unitenclosure 21, namely at a first end. Airflow is introduced into the unitenclosure 21 through the air inlet 23 for cooling central processingunit (CPU) chips, for example. The air inlet 23 is opposed to the floorwhen the system board unit 14 is set in the upright attitude. A numberof air intake openings 24 are also formed in the top plate of the unitenclosure 21 at a predetermined section. Airflow is also introduced intothe unit enclosure 21 through the air intake openings 24 for cooling theCPU chips. The top plate of the unit enclosure 21 is opposed to thebottom plate of the adjacent unit enclosure 21 at a certain intervalwhen the system board unit 14 is set in the aforementioned uprightattitude.

A printed circuit board unit 26 namely the system board, is placedwithin the inner space of the unit enclosure 21. FIG. 3 schematicallyillustrates the inner structure of the system board unit 14. FIG. 3shows the system board unit 14 without the top plate. As shown in FIG.3, the printed circuit board unit 26 includes a printed wiring board 27.The printed wiring board 27 extends along the bottom plate of the unitenclosure 21. The printed wiring board 27 may rigidly be fixed to thebottom plate. The other side, namely a second end, is defined at aposition opposite to the side defining the air inlet 23. An opening,namely an air outlet 28, is formed in the other side. A path of theairflow is established from the air inlet 23 and the air intake openings24 to the air outlet 28, respectively.

First electronic components, namely first large-scale integrated circuit(LSI) packages 31, 31 are mounted on the surface of the printed wiringboard 27. The first LSI packages 31, 31 are spaced from the air inlet 23by a first distance. The first LSI packages 31, 31 are arranged side byside. The individual first LSI package 31 includes a CPU chip, notshown, mounted on a small-sized ceramic substrate or the like. The CPUchip executes various kinds of processing based on software programsand/or data temporarily stored in a memory, for example. The memory willbe described later in detail.

A heat radiating member, namely a first heat sink 32, is received on theindividual first LSI package 31. The first heat sink 32 includes a mainbody in the form of a flat plate, namely a heat plate, and fins standingupright in the vertical direction from the heat plate. Air passages aredefined between adjacent ones of the fins. The air passages are setparallel to one another. The fins may extend in parallel with the frontand back surfaces of the unit enclosure 21.

Second electronic components, namely second LSI packages 33, 33 arelikewise mounted on the surface of the printed wiring board 27. Thesecond LSI packages 33, 33 are spaced from the air inlet 23 by a seconddistance larger than the aforementioned first distance. The second LSIpackages 33, 33 are arranged side by side. The individual second LSIpackage 33 includes a CPU chip mounted on a small-sized ceramicsubstrate or the like. A heat radiating member, namely a second heatsink 34, is received on the individual second LSI package 33. The secondheat sink 34 may have the structure identical to the structure of thefirst heat sink 32.

Electronic circuit elements such as power source units 35, DC-DCconverters 36, memory boards 37, controller chips 38 related to thememory boards 37, a chip set 39, or the like are mounted on the surfaceof the printed wiring board 27. Heat sinks are received on theindividual power source unit 35, the individual controller chip 38 andthe chip set 39, respectively. These heat sinks define air passagesalong the direction of the airflow.

Here, the first LSI package 31 serves as a first component unit of thepresent invention. The second LSI package 33 serves as a secondcomponent unit of the present invention. The first and second LSIpackages 31, 33 serve as a first component of the present invention. TheDC-DC converters 36, the memory boards 37 and the controller chips 38serve as a second component of the present invention.

The chip set 39 is coupled to the aforementioned connector. Signals aresupplied to the chip set 39 from the back panel. The chip set 39 servesto pass the signal to the first and second LSI packages 31, 33. It isdesirable to exchange the signals between the chip set 39 and each ofthe CPU chips by the shortest distance. It is also desirable to locatethe chip set 39 at a position closest to the back of the unit enclosure21. Accordingly, the first LSI packages 31 are located away from the airinlet 23 by a distance different from the distance between the air inlet23 and the second LSI packages 33.

As is apparent from FIG. 3, first and second spaces 41, 42 are definedin the unit enclosure 21. The first and second spaced 41, 42 aredesigned to extend from the air inlet 23 to the air outlet 28,respectively. The first and second spaces 41, 42 are arranged side byside. The first space 41 is defined along the back of the unit enclosure21. Specifically, the first space 41 is defined on the backside of thesystem board unit 14. The second space 42 is defined along the front ofthe unit enclosure 21. Specifically, the second space 42 is defined onthe foreside of the system board unit 14. The first and second LSIpackages 31, 33, the power source units 35, and the chip set 39 areplaced in the first space 41.

The second space 42 includes a lower space 47 defined along the surfaceof the printed wiring board 27 and an upper space 48 defined along thetop plate of the unit enclosure 21. The lower and upper spaces 47, 48are located adjacent to the first space 41. The lower space 47 isinterposed between the upper space 48 and the surface of the printedwiring board 27. Third electronic components such as the memory boards37 and the controller chips 38 are placed in the lower space 47. Theheight of the memory boards 37 and the controller chips 38 from thesurface of the printed wiring board 27 is set smaller than that of thefirst and second heat sinks 32, 34.

A guiding member 43 is placed in the upper space 48. Specifically, theguiding member 43 is placed in a space between the top plate of the unitenclosure 21 and the upper ends of the memory boards 37 and thecontroller chips 38. The guiding member 43 is attached to the ceiling ofthe unit enclosure 21, for example. An adhesive is for example utilizedfor the attachment. The guiding member 43 may be made of a light resinmaterial such as an expanded polystyrene or the like. The guiding member43 serves to guide airflow introduced from the air inlet 23 opened atthe second space 42. The thickness of the guiding member 43 is setidentical to that of the upper space 48.

The guiding member 43 defines an air guiding surface 44 at its front endsurface opposed to the air inlet 23. The air guiding surface 44 isinclined relative to the direction of the airflow running straight fromthe air inlet 23 to the air outlet 28. The air guiding surface 44extends toward the fins of the second heat sinks 34. A side surface ofthe guiding member 43 may contact with the side surface of the fin ofthe second heat sink 34. The opposite side surface of the guiding member43 may contact with the front wall of the unit enclosure 21.

The air guiding surface 44 gets closer to the air outlet 28 at aposition closer to the back of the unit enclosure 21 away from the frontof the unit enclosure 21. The air guiding surface 44 extends from aposition remote from the first space 41 in the second space 42 toward aposition close to the first space 41 in the second space 42. Likewise,the air guiding surface 44 gets remoter from the air inlet 23 at aposition closer to the second heat sinks 34. In other words, the airguiding surface 44 extends from a position close to one side of the unitenclosure 21 to a position close to the other side of the unit enclosure21.

FIG. 4 schematically illustrates the position of the air intake openings24. As shown in FIG. 4, the aforementioned air intake openings 24 areformed in the top plate of the unit enclosure 21 at a first section 51opposed to the surface of the printed wiring board 27 between the firstand second heat sinks 32, 34. A second section 52 is defined on the topplate of the unit enclosure 21 at a position adjacent to the firstsection 51. The second section 52 is located closer to the air inlet 23than the first section 51 is. The second section 52 is opposed to thetop of the first heat sink 32 located at the position adjacent to theback of the unit enclosure 21.

The widths of the first and second sections 51, 52 are measured in thedirection from the front of the unit enclosure 21 toward the back of theunit enclosure 21, respectively. The width of the first section 51depends on that of the second section 52. The width of the first section51 corresponds to twice the width of the second heat sink 34 accordingto the embodiment. The width of the second section 52 corresponds tothat of the second heat sink 34. The width of the second heat sink 34 islikewise measured in the direction from the front toward the back of theunit enclosure 21.

Now, assume that airflow is generated in the enclosure 12 of the servercomputer 11. The airflow generated in the fan units 15 runs in thevertical direction from the bottom toward the top of the enclosure 12 asdescribed above. The unit enclosure 21 of the individual system boardunit 14 takes the upright attitude in the enclosure 12 of the servercomputer 11. The air inlet 23 is directed to the floor. The verticalairflow from the bottom of the enclosure 12 is introduced into the unitenclosure 21 of the system board unit 14 through the air inlet 23.

FIG. 5 schematically illustrates the airflow within the unit enclosure21. As shown in FIG. 5, airflow 55 runs into the first space 41 throughthe air inlet 23. The heat of the first LSI packages 31 is transferredto the first heat sinks 32, respectively. The airflow 55 absorbs theheat from the fins of the first heat sinks 32. The first LSI packages 31thus get cooled. The first LSI packages 31 are prevented from a rise intemperature. The airflow 55 then runs toward the air outlet 28 from thefirst heat sinks 32. The airflow 55 is discharged out of the air outlet28. It should be noted that the airflow 55 also serves to coolcomponents other than the first LSI packages 31 placed on the path ofthe airflow 55.

Airflow 56 likewise runs into the lower space 47 of the second space 42through the air inlet 23. The airflow 56 runs along the memory boards 37and the air passages of the heat sinks on the controller chips 38. Theairflow 56 absorbs heat from the memory board 37 and the fins of theheat sinks on the controller chips 38. The memory boards 37 and thecontroller chips 38 thus get cooled. The memory boards 37 and thecontroller chips 38 are prevented from a rise in temperature. Theairflow 56 is then discharged out of the air outlet 28.

As shown in FIG. 6, airflow 57 also runs into the upper space 48 of thesecond space 47 through the air inlet 23. The airflow 57 collidesagainst the air guiding surface 44. The air guiding surface 44 getsremoter from the air inlet 23 at a position closer to the second heatsinks 34, so that the airflow 57 is guided to the second heat sinks 34along the air guiding surface 44. The airflow 57 absorbs heat from thefins of the second heat sinks 34. The second LSI packages 33 thus getcooled. The second LSI packages 33 are prevented from a rise intemperature. The airflow 57 is then discharged out of the air outlet 28.

The airflow 57 is allowed to run into the upper space 48 of the secondspace 42 as described above. The airflow 57 thus fails to touch thefirst LSI packages 31 as large heat sources placed in the first space41. Likewise, the airflow 57 fails to touch the memory boards 37 and thecontroller chips 38 placed in the lower space 47 of the second space 42.The airflow 57 thus reaches the second heat sinks 34 without absorbing alarger amount of heat. The airflow 57 is allowed to efficiently coolonly the second LSI packages 33.

The system board units 14 are placed within the enclosure 12. Theintervals or gaps are defined between adjacent ones of the system boardunits 14 as described above. As shown in FIG. 7, airflow 58 from thebottom of the enclosure 12 is introduced into the gaps. The airflow 58is allowed to run into the unit enclosure 21 of the individual systemboard unit 14 through the air intake openings 24. Since the air intakeopenings 24 are located in the first section 51 established between thefirst and second heat sinks 32, 34 as shown in FIG. 4, the airflow 58reaches the second heat sinks 34, 34 without absorbing heat from thefirst heat sinks 32. The airflow 58 absorbs heat from the second heatsinks 34. The second LSI packages 33 are thus prevented from a rise intemperature.

The airflow 58 is also allowed to run through the air intake openings 24at the second section 52 toward the chip set 39. Since the airflow 58reaches the chip set 39 without absorbing heat from other components,the airflow 58 efficiently absorbs heat from the fins of the heat sinkon the chip set 39. The chip set 39 is thus prevented from a rise intemperature. Even though the first LSI packages 31, the chip set 39 andthe second LSI packages 33 are arranged in this sequence from a positionnear the air inlet 23 to a position near the air outlet 28, the secondheat sinks 34 on the second LSI packages 33 and the heat sink on thechip set 39 enjoy an unheated airflow.

The server computer 11 allows the airflow 55 to run toward the firstheat sinks 32 from the air inlet 23. The first LSI packages 31 thussufficiently get cooled. The server computer 11 also allows the airflow57 to run toward the second heat sinks 34 from the air inlet 23 with theassistance of the air guiding surface 44. The airflow 58 is also allowedto run toward the second heat sinks 34 from the air intake openings 24.The second LSI packages 33 thus sufficiently get cooled. Even though thesecond LSI packages 33 are placed downstream of the first LSI packages31, the first and second LSI packages 31, 33 can get cooled quiteequally. The processing speed of the CPU chips can thus be enhanced.

1-11. (canceled)
 12. An electronic apparatus comprising: an outerenclosure; and an electronic component unit attached to the outerenclosure, wherein said electronic component unit comprising: a unitenclosure; a first opening formed in the unit enclosure at a first endof the unit enclosure; a second opening formed in the unit enclosure atthe first end at a position adjacent to the first opening; a thirdopening formed in the unit enclosure at a second end opposite to thefirst end; a first component placed in a first space defined between thefirst and third openings; a second component placed in a second spacedefined between the second and third openings; and a guiding memberplaced in a third space defined in the second space at a positionadjacent to the first space.
 13. The electronic apparatus according toclaim 12, further comprising a fan placed within the outer enclosure,said fan generating airflow running from the first and second openingstoward the third opening.